Interdisciplinary real-world laboratory for the integration of semiconductor components for innovative building technology system solutions

The aim of the project is to build up the necessary expertise for the development of soft sensors for building technology applications. Specifically, this includes sensor identification and sensor communication, sensor integration, processing and packaging and the implementation of suitable optimisation and AI algorithms. In addition, infrastructures for specific application development at room level, system level and component level are to be set up in the form of real laboratories. This will allow product developments to be carried out under both laboratory and real-life operating conditions in the future and the functionality and long-term stability to be demonstrated.

During the set-up phase, expertise will be built up in the following areas

• Sensor integration on circuit boards
• Sensor communication with microcontrollers
• Module design, processing and packaging
• Sensor selection, evaluation and validation
• Communication at semiconductor sensor level (e.g. I2C, SIP, LVDS etc.)
• Communication at the level of technical building systems. (MQTT, LoRaWAN etc.)
• Development of soft sensors
• In addition, three real laboratories are being set up:
• Test room for the development of soft sensors for the more efficient recording of IEQ parameters and for the optimisation of DDPC & OC methods.
• Real building technology test facility consisting of a full air conditioning system, heat recovery system, heat pump, PV system, etc.
• Test room to develop sensors for material climate measurement to prevent moisture damage.